Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Mon Oct 21 09:22:56 EDT 2013 | sara_pcb
One of our PCB for high reliability application is having 2 BGAs(11X11, ADV 204), The pitch is 1 mm. We decided to wire the BGAs first using re-flow soldering and the rest of the components by hand soldering. Since the PCBs are for high reliability a
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
Electronics Forum | Sun Feb 15 17:32:08 EST 2004 | brian bennett
i have always found any of the alcohol based solvents good.here in the uk we use the alpha make.with screen auto wipes i found the set up to be most important.i.e how many pcb's printed before wiping.i found running pcbs with bga and .50 pitch compo
Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Tue May 23 17:49:07 EDT 2006 | flipit
Hi, Ok I have some numbers for you on my process. For the last 2 years we have been placing 4 BGA on a 2" X 5" X 0.062" PCB. The BGAs are 16X16 256 ball, 15X11 165 ball, 8X8 64 ball, and 26X26 456 ball. The 8X8 is 0.8mm pitch and the others are 1
Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen
Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a
Electronics Forum | Mon Jun 24 19:15:13 EDT 2002 | Chris C
Do I really need a Vapour Phase Oven or a Nitrogen Oven when soldering PBGA's if my PCB has only 2 to 3 BGA's (ball pitch of 0.5mm to 1.27mm) ? Is the quality of soldering when using an 8-Zone Convective Oven is not acceptable? I have been bombarded
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