Electronics Forum | Thu May 05 14:58:20 EDT 2005 | russ
Looked at it on the web, I believe that it will place those 600 parts in less than 2 hours! And you guys were thinking that it is slow? Ken, not only will it solder those parts with its blazing speed but did you know that you don't even need a sten
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Wed Sep 25 06:56:16 EDT 2002 | CH
U may check your profile ramp rate. The flux may evporated and look like cold joint
Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch
Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb
On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t
Electronics Forum | Wed Sep 25 10:56:27 EDT 2002 | xrayhipp
Yeah, perhaps lean more towards a ramp-to-spike profile - reducing the soak time and add a littel heat to your temp above liquid. This has worked for us with water soluable paste as we are not required to use no-clean and utilizing a 6-zone oven. G
Electronics Forum | Mon Aug 13 09:20:46 EDT 2018 | sara_pcb
What is the difference between jet printing & jet dispensing. Our's is small prototyping, high reliability PCB assembly business. The SMT components used are up to 0.4 mm pitch BGA & 0201 size chips. Which is more suitable for us?
Electronics Forum | Sun Jun 28 09:02:37 EDT 2009 | davef
Daan Terstegge's excellent jump site has a collected information on 0201 here: http://www.smtinfo.net/Db/_0201%20Sized%20Components.html
Electronics Forum | Sun Jun 28 17:07:13 EDT 2009 | mark_h
Thanks Dave, On first inspection it looks like it has a wealth of information...