Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq
Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!
Electronics Forum | Sat Nov 25 21:26:55 EST 2006 | callckq
Dear all, I have an issue here where we found BGA crack. Understand from friend, we need to study any possiblity of our own jig or fixture cause this problem via strain gauge measurement..My question: Is there any standard @ specification establish
Electronics Forum | Wed Sep 09 11:17:09 EDT 2009 | clampron
Hello Radek, Does a new (unbaked) BGA exhibit the same crack? If so, adress this with the manufacturer. If not, what are your baking parameters? Chris
Electronics Forum | Thu Feb 21 16:28:44 EST 2002 | Dave G
Sounds like the Infamous "Black Pad" Phenomenon to me. A search through the Archives should bring up lots of stuff. DG
Electronics Forum | Fri Sep 04 02:27:48 EDT 2009 | hurr
Hallo all, when I remove one from us malfunction BGAs from PCB I saw under X-ray inspection inner hairline crack.(see fig.1.) BGA was dried according to J-STD 033 and reflowed in lead process. When I look at new (baked BGA) under X-Ray inspection I
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Fri Feb 22 08:26:51 EST 2002 | davef
You are correct. The gold dissolves in the solder. The gold is meant to protect the nickel from oxidizing, so that you can solder to the nickel. Obviously that didn�t work as planned. Your background information is very sparse. Two things come
Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef
This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold
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