Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Fri Oct 01 14:16:15 EDT 1999 | Rick
I know there are a ton of variables that affect the overall height of a BGA after soldering to a PWB but... I'd like to know if anyone has done an analysis of (or if it's documented) as to what the pre and post reflow height dimension as measured fr
Electronics Forum | Wed Oct 30 09:43:01 EST 2002 | gregp
Larger tighter spaced balls will present a problem in sealing the vacuum cup. There will be more leakage in this case. It really depends upon the application. The BGA you mention should not be a major concern. The bigger problems are with bigger
Electronics Forum | Sat May 24 07:21:51 EDT 2003 | davef
Try: * Aries 908.996.6841 * Antona 310.473.8995 * Oztech 510.782.2654fax2656 * Emulation Technology 408.982.0660 800.232.7837 fax 0664 emulation.com * Interconnect Systems (BGA/BGA, BGA/QFP, BGA/PGA) 708 Via Alondra Camarillo CA 93012 805.482.2870 fa
Electronics Forum | Tue Sep 14 07:54:05 EDT 2004 | modwyer
Folks, At the moment I bake all BGA that are in unsealed trays, to reduce moisture etc. Is this common practice or are there particular manufacturuers that cause more problems. Also, the tape for BGA tape & reel has a hole in the tape (as is normal
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Thu Dec 10 03:37:29 EST 1998 | Youngho Song
Hi everybody? I heard that typical FR-4 would not acceptable for BGA application. What is the main reason? (thermal property? or CTE?) Sombody please answer me the requirement of PCB substrate for PCB application. Thanks. Youngho Song
Electronics Forum | Mon Jul 20 23:09:27 EDT 1998 | Stoney Tsai
We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. Thx for any information Best Regards, Stoney Tsai
Electronics Forum | Sat Aug 15 07:52:48 EDT 1998 | Clyde F.
| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai
Electronics Forum | Thu Oct 24 06:01:16 EDT 2002 | Kent
I'm currently dealing with an design of an end effector that need to pick n place a BGA dead bug package. The design is using peumatic system to do the task. Any advise or suggestion on this kind of design?
