Electronics Forum | Mon Oct 31 10:54:05 EST 2005 | Rob
Hi Vickt, Future upgrades on machine software should be free when they fix known bugs/problems. However these are usually sold as upgrades with additional benefits thrown in. That's just hiding the fact there was a problem in the first place, an
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Electronics Forum | Tue May 18 15:36:18 EDT 1999 | Tony
| | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil,
Electronics Forum | Tue Jan 17 10:17:55 EST 2006 | Loco
Solder balls that have more than 0,1% PB are not RoHS compliant. It might be RoHS compatible meaning it can handle the higher temperatures used in a leadfree process.
Electronics Forum | Thu Dec 05 17:40:24 EST 2002 | davef
While unfamiliar with some of the terms you use, could this be what you seek? http://www.pcbstandards.com/downloads/Metric%20Environment/General%20Documentation/PCB%20Design/PCB%20Design%20Routing/Metric%20BGA%20Routing.pdf Stepping backwards just
Electronics Forum | Wed Jul 06 04:27:30 EDT 2005 | aj
Javi, If the components are caps and resistors etc there should not be much problems. I would say everyone at this stage has a mixture of leadfree and lead components. The problem really starts when you are running the likes of Leadfree BGA where th
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Thu May 17 09:53:14 EDT 2007 | mohdfazuwan
For ur information, this BGA machine was full utilize every day. I have more than 100 model to do profiling every week. Different PCBA with different thickness & material need different temp setting. currently i'm looking for profiler that more compa
