Electronics Forum | Tue Jun 27 11:54:56 EDT 2006 | muse95
I don't understand why you think a BGA would be better than a QFP. Half the process questions I see on this forum seem to deal with BGA's, and the switch to Pbfree processing is a far greater hassle - Pb free QFP's will be compatible with either pro
Electronics Forum | Sat Dec 10 20:58:05 EST 2005 | Mike
How about this scenario: Need to rework a BGA on a 2 year old board. Originally the board was assembled with Sn63/Pb37 and the BGA has eutectic spheres. Now this package only comes with lead free balls. I believe that the board finish is not idea
Electronics Forum | Wed Aug 24 11:05:44 EDT 2005 | patrickbruneel
Javi, The reason you have an exemption for your product is because there are reliability concerns for lead free and it is impossible at this stage to guaranty backward compatibility. If a cell phone, TV or radio fails, no lives are at risk, you just
Electronics Forum | Mon Nov 13 18:36:32 EST 2023 | emeto
Your reflow profile should be designed towards the flux in your solder paste. To form a proper inter-metallic layer, you need to reach 20-30C above your melting point and stay in liquidus state for certain amount of time. SAC 105 has 3C difference fr
Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony
| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi
Electronics Forum | Fri Feb 11 05:32:31 EST 2000 | Dean
Your customers design and your process capability would determin this (W/S vs. noclean). EX. Can you clean adequately for low stand off components? I have some BGA products which operate at 20GHz (atenuation and cross-talk is off the charts. )No wa
Electronics Forum | Mon Jan 10 16:58:48 EST 2011 | piter
Hi Ripal it seems that you have problem with compatibility of alloy and quality of solder balls. First check solder alloy form BGA balls what is it?(SAC105,SAC305, etc.) what type of solder paste you use?? third thing is what type of finishing you h
Electronics Forum | Tue May 18 14:15:59 EDT 1999 | Scott McKee
| | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after
Electronics Forum | Tue May 18 16:24:25 EDT 1999 | Scott McKee
| | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-st
Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne
Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (
