Electronics Forum | Mon Jun 13 07:44:15 EDT 2005 | bandjwet
Peter: Based on our company's experience with removing a variety of different coatings, including parylene, the BGA's can be removed. We would use a chemical etch followed by a neutralizing process. We would then reflow the devices and pry them off
Electronics Forum | Wed Feb 06 15:51:26 EST 2008 | jax
We have place CSP devices with 0.105mm standoff hights without any issue. The ability to Water Wash all depends on the specifications of your wash... Spray pressure and qty of jets Dwell time, pre-wash/wash/rinse Available detergents or saponifiers
Electronics Forum | Thu Sep 16 09:29:21 EDT 2010 | san_1023
Weller and Hakko have some good soldering > stations, hot air SMD rework system and BGA > rework systems: _a class=roll > href="http://www.wellersoldering.blogspot.com/" > target="_blank"_http://www.wellersoldering.blogspo > t.com/ _/a_ I am t
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
Electronics Forum | Mon May 09 12:26:17 EDT 2005 | stepheniii
If followed, would the following strategy meet the requirements of IPC/JEDEC J-STD-033A; All MSD components are either exposed for less than 1/2 an hour or final reflowed within 12 hours of opening. What I mean by exposed is any time the parts are n
Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Sat Oct 19 08:06:06 EDT 2002 | johnw
You know I knew I used this forum for a reason, probably the most complete knowledge base going. I too use Indium and yoru right the minite you hit any stuborn oxides then your bust. The problem however is that the customer tends to dictate what we
Electronics Forum | Tue Oct 25 16:27:46 EDT 2005 | stepheniii
It is not OK to use leadfree BGA's with a lead process. Other parts "should" be reverse compatable. But I first saw problems over 5 years ago with Paladium leads and a lead process. Don't confuse saying "it's ok to use lead free parts in a leaded p
Electronics Forum | Thu Feb 02 09:06:53 EST 2006 | drewake
Sorry, I am jumping into this late - I'm a new user. Our company is looking to perform an evaluation for a new paste. We are looking at a 63/37 no clean - type 3 or 4. Our technology is currently at 0201s, .4mm pitch ICs & .5mm uBGAs. I have
