Electronics Forum | Fri Oct 06 08:22:05 EDT 2000 | jackofalltrades
BGA's are not difficult, but should be inspected no matter how careful you are. Here we have been doing bga's forever and x-ray 100%. Without an x-ray there is no good way to ensure the BGA is placed properly, without bridging or insufficients. If yo
Electronics Forum | Fri Jun 14 18:01:04 EDT 2002 | john_wsme
Dave and Russ, Today we modified the profile to ramp up slowly and have longer preheat time. The result is great, 0 out of 5 without bridging. I did review the FAB design and seen the pad is much biger than ball size. So I guess it is the problem.
Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Fri Aug 20 14:51:47 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
Electronics Forum | Fri Aug 20 14:51:55 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
Electronics Forum | Fri Aug 20 17:17:14 EDT 1999 | K.T
| | | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | | | This is what I did. | | | | | | | |
Electronics Forum | Thu Sep 06 05:43:15 EDT 2018 | cmchoue
Thank you Mr.Spoiltforchoice, My question is not clear , let me show you a photo Did you have any suggestion? Thanks James
Electronics Forum | Mon Jun 03 11:51:44 EDT 2002 | Troy
A 50KV machine will allow you to see solder bridges and balls under the BGA. It will also allow you to check placement and can "see" through the metal housing. If you want to inspect for voids, then you what to look at equipment in the 100KV range.
Electronics Forum | Mon Mar 27 08:28:48 EST 2000 | Mark Alder
Dear Robert The reason for the bridging problem you are experiencing on your BGA's is due because of too much solder. The PCB pads need to be at least 15% larger than the sphere size of the BGA balls. If you are not using C4 (63/37) BGA spheres and
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