Electronics Forum | Mon Nov 21 09:23:06 EST 2005 | Amol
With a BGA, how much solder paste are you putting on the pads? sometimes, bridging occurs when there is more solder paste than needed during reflow.....just a thought
Electronics Forum | Fri Apr 17 16:00:52 EDT 1998 | Michael Allen
X-ray can be helpful in trouble-shooting BGA component failures. Test techs can quickly determine whether or not a BGA has solder bridges. When a bridge is found, this can eliminate hours of trouble-shooting. And when a bridge is not found, the te
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Wed Apr 28 12:10:14 EDT 2004 | paul_bmc
Are your solder balls after reflow a perfect sphere or are they oblong, like chushed. I know a heavy bga or incorrect reflow profile could cause bridging. Also too much flux paste. Sometimes what we do is brush the flux paste onto the pcb pads inst
Electronics Forum | Wed Jul 03 10:37:41 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Thu Jun 21 07:57:09 EDT 2001 | brownsj
One of the systems I saw which was very good for a low cost inspection system was the Ersascope. http://www.ersa.com. This sytems looks underneath the BGA from the side so it will detect bridges though it probably isn't very good for insufficients. I
Electronics Forum | Thu Sep 06 11:24:56 EDT 2018 | davef
pdf "BGA Stencil design guideline for avoid bridge" As you would expect, Google found 40,000+ results in less than a second One of my favorites was Power Point Presentation by Greg Smith [gsmithATfctassembly.com] at FCT Assembly: "Improve SMT Assem
Electronics Forum | Thu Feb 11 06:50:17 EST 2010 | CL
Good Morning Bryan, We are using Mirtec MV-3 AOI's with 4 megapixle cameras. We use them for 100% post reflow. We are checking, presence, polarity, value, solder, bridging,component height for BGA, QFN etc... and 1st piece validation for machine set
Electronics Forum | Wed Aug 13 18:12:20 EDT 2003 | Carol
Has anyone tried to get conformal coating under a BGA? (large package MPC555). There is a concern with ionic/metal bridges developing between contacts due to accumulation of dust/humididty. Final product is Class 3 (aerospace). Thanks, Carol
