Electronics Forum | Thu May 17 22:57:43 EDT 2001 | davef
It is amusing. Tell us about the profile, how you shot the vid, was the component "bug up" or "bug down", causes of the bridging, etc
Electronics Forum | Fri Jan 14 17:09:21 EST 2005 | Bob R.
Whether or not conformal coating creates a reliability problem if it bridges the gap between the board and bottom of the part depends on the properties of the coating. A low modulus coating is fine, but one thats modulus increases at colder temperat
Electronics Forum | Mon Apr 03 07:46:21 EDT 2006 | cyber_wolf
I have a pad layout that has .010" dia. with .010" spacing. Going to use a .004" foil. I know I need to over print them, but how much without causing bridging issues ? Thanks, Sr.
Electronics Forum | Wed Jun 08 20:21:42 EDT 2011 | kahrpr
I agree that it looks like to much solder paste. Thats a lot of bridging in one area. It had to get the solder from some ware.
Electronics Forum | Thu Sep 15 16:07:19 EDT 2016 | davef
In electronic manufacture, it's never good when "oozing" is part of the conversation. "Bridging" that's bad too. "Melting" sometimes good, sometimes bad. Got pix? How about some nice color pictures?
Electronics Forum | Tue Jun 30 09:59:44 EDT 2020 | cph4w
Hi SRINI, Are you able to show X-ray of these 2 locations from other board w/o bridging? Void looks almost perfect circle which I never encountered before.
Electronics Forum | Tue Jul 18 00:24:10 EDT 2023 | stephendo
Those photos also look like delamination. The balls are smaller where the bridging is. There isn't more solder. It's that the solder is somehow squeezed together. Check the BGAs after removing to see if they do have a bulge. Maybe the pcb is flexi
Electronics Forum | Wed Nov 05 13:43:52 EST 2003 | swagner
I just did a bga job with square aperture's, the reasoning is for enhanced print release and additional paste volume. Be careful of the edge to edge clearance between the stencil openings, I don't recommend going below a 8 mil clearance, you could b
Electronics Forum | Tue Mar 02 10:24:06 EST 2004 | russ
I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way the
Electronics Forum | Fri Mar 23 09:13:48 EDT 2007 | Peter W
Hello, those plated and solderable via in pads have two critical points: 1. We have discovered that _sometimes_ the plating seems not to be perfect, as extreme voiding is visible in tha bga solder ball 2. The detection of some defects by AXI is limi
