Electronics Forum | Sun Jan 14 16:35:48 EST 2007 | Austin
I have several boards built at various CM's. We have prototype builds with some JTAG failures on BGA's (1-3 failures with qty 3, 1500 pin BGA's). CM's always claim reflow profiles look good. X-ray does not show bridges and they claim it looks good, b
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Sun Apr 16 14:37:25 EDT 2000 | Roberto Navarro
Hi, I work for Nortel and here rework BGA'S we use DRS22 rework station and CRT 2000 X-ray inspection. The main problem is put again the BGA on the PCB because you need reboling the PCB and you could damage the soldermask. Talking about Air-vac is ve
Electronics Forum | Mon Oct 21 08:46:15 EDT 2002 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohi
Electronics Forum | Tue Apr 15 15:29:59 EDT 2003 | joeherz
If I did the math correctly, we're talking about over 600 BGAs to rework. I have nothing of relevance to add other than Chrissie should be given a medal for not jumping off a bridge or tall building. Let's save that fate for the operators who didn'
Electronics Forum | Wed Mar 14 16:23:01 EDT 2007 | J
I am not sure Ersascope and X-Ray will tell you the results you are looking for. My experience with x-ray has proven that misalignment, voids, and bridging are really the only failures that can confidently be observed. You may have solder in place,
Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef
Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w
Electronics Forum | Thu Jun 09 10:01:06 EDT 2011 | pcbrookie
Thanks for the input! In looking at the image again, along w/ some of the others we were supplied with it does look like it could just be too much solder. As mentioned, that does look like a lot of solder bridging up there. It will likely be a wh
Electronics Forum | Thu Feb 07 12:04:11 EST 2019 | davef
Over the years, Bob has contributed many videos and pictures that have help identify and solve production issues. I recall a vid of a bug-up BGA being heated to liquious that showed the balls swelling in the heat to the level that they bridged. Bril
Electronics Forum | Tue Mar 09 22:20:16 EST 2004 | Ken
Is this a PBGA? If yes. run a flat steel rule or edge across the top of the PBGA. Is it flat or cupped? Is this a TBGA (super bga). I have seen issues with a suppliers heat spreader design that actually will deflect the corners down and raise the
