Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Wed Sep 02 06:50:55 EDT 1998 | Masdi Muhammad
Hi, We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it. Than
Electronics Forum | Wed Jan 16 22:57:52 EST 2008 | amarpreet41
Any one got experience on handling solder bridging under one corner of BGA?
Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala
Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Tue Jan 22 22:23:48 EST 2008 | amarpreet41
Thanks, I am working on to prevent solder bridging. Tried fine tuning reflow profile, solder printing looks fine. Any further ideas??
Electronics Forum | Wed Jan 23 19:44:45 EST 2008 | hegemon
In addition to the pre-emptive steps mentioned above, in my experience there are certain BGA package designs that seem more prone to that corner bridging. I have seen some packages that will essentially "curl" down at one corner as the package begin
Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus
| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
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