Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Wed Oct 07 15:25:02 EDT 1998 | Joe P.
Hi Everybody | | Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. | We have alread
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul
I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15
Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest
Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results
Electronics Forum | Wed Dec 29 15:13:29 EST 1999 | Larry Johnson
Yes, you can place BGA's with your GSM using that software. However, I don't know how critical you want to be when reading the bumps, if you want to read them at all. I did an experiment once using the same BGA, using both bump process A and E . E
Electronics Forum | Fri Jul 09 14:56:45 EDT 1999 | Mark
| Does anyone know of a company that reballs BGA's? Im looking for a reliable source that can do a 10/90 alloy. | Yes I do know of the company BGA Bumps and all they do is reball BGA IC's. Check out their web page below.
Electronics Forum | Tue Mar 04 06:33:38 EST 2008 | reypal
The attached photo from cross section. (like head in pillow)
Electronics Forum | Tue Apr 24 10:05:09 EDT 2001 | Robert Steltman
Help please.... We have just run a prototype board using a number of BGA devices on it. The corners on two of the BGA's (PBGA357) seem to be higher than the centre of the device. ie the outer bumps seem to be "stretched" compared to the centre bumps
