Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal
Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water
Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef
We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia
Electronics Forum | Mon Oct 30 20:24:35 EST 2006 | davef
As we understand it, you: * Get some nice BGA from your supplier * Find BGA to be packaged properly * Bake the BGA for 24 hours at [what temperature?] to reduce the potntial for damaging moisture sensitive components during following processes * Remo
Electronics Forum | Wed Mar 31 21:08:34 EST 2004 | Ed
Hey guys. I've been manually dunking circuit boards for 8 years now. I too have the excess residue issue to contend with. I'm using a low solids - no clean flux from Kester (959). I have used solvents, thinners, windex and a multititude of cleane
Electronics Forum | Thu May 07 08:31:13 EDT 1998 | Alan Pestell
We are about to use BGAs on our equipment. We clean all products prior to confomally coating them - to keep moisture off the IC legs. Will this be a problem with BGAs. Will we need to get the coating underneath the BGA or will the pitch on the balls
Electronics Forum | Mon Oct 30 21:00:31 EST 2006 | hanocete
thanks for your inputs,but what i meant was that a connector component beside the BGA for repair has some flux residue on its leads after baking, the BGA was Ok. we are wondering why this happened...pls enlightened us.
Electronics Forum | Tue Oct 31 01:32:47 EST 2006 | hanocete
thanks for your reply, actually we bake the PCB assembly prior the rework because the package was exposed for quite some time already. The baking time was 24hrs @ 125 deg.C. We notice that there were flux residues on the connectors after the baking.
Electronics Forum | Sun Oct 29 22:41:29 EST 2006 | hanocete
We have a current problem on our packages after we bake it for 24 hrs prior BGA rework. Flux or white residues found on the connector leads and terminals that cause not contact problems during mating. Could you help us how to clean the fluxes properl
Electronics Forum | Mon Oct 30 21:43:08 EST 2006 | davef
So, after the repair of a BGA, you notice white reside on a nearby connector. Correct? [Sorry we're so dense. Long day.] Tell us about: * Flux class used in repair * Flux class used in original assembly Why are you baking the assembly after repair
