Electronics Forum | Mon Sep 08 02:39:37 EDT 2008 | akareti
By connector, you mean socket? Connector use for board to board connection from FCI, MFG P/N: 84500-202 What is the material of the connector(socket)? Is it very frigale? Housing: liquid crystal polymer Solder ball: SnPb 63/37 how big are the bal
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Mon Apr 09 02:57:16 EDT 2018 | robl
Hi, these are both power pins, usually connected to a dedicated inner VDD/VDDQ 1oz copper layer, making a very effective heatsink. I am guessing that not enough heat got to the ball to fully melt it, creating a weaker column rather than a beautifull
Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
Electronics Forum | Thu Jul 25 22:03:50 EDT 2002 | davef
I need help understanding your problem. * What�s the difference between �e-test failure� and �total failure�? * Why do you think that an ESD induced failure would only be a �total failure�? * What if this is caused by a cracked solder connection? Yo
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Fri Aug 13 08:38:31 EDT 2021 | compit
> Any idea how to get the machine to see this part > and place it square??? I am really struggling. I > have tried it as a BGA but it never works The > part is on page 43-44 > https://connectivity-staging.s3.us-east-2.amazonaw &
Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef
Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo
Electronics Forum | Wed Apr 09 13:30:20 EDT 2003 | davef
In order to get reliable reflow, you need to be at or higher than [liquidus + 20*C] for about 5 to 10 seconds. [I said 25* in a earlier post, but in an effort to stay on message, I'll stick with 20*] Don't forget that your liquidous is probably NOT
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