Electronics Forum | Wed Aug 30 23:45:23 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Wed Aug 30 23:45:40 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Wed Aug 27 08:46:14 EDT 2008 | vladig
Hi Sean, It's an old problem with no definitive cure for now. However, there are a couple of things to look for. First of all the location(s) of HoP. If it was due to the componetn warpage, then it would be most probably in the middle and it should
Electronics Forum | Wed Jul 08 02:50:30 EDT 2020 | rsatmech
Hi DucHoang, Thanks for the response. I will share the images. We are using OSP boards and issue is not at particular BGA. Can you suggest me any methods to identify the pad contamination.
Electronics Forum | Sat Jul 27 14:30:56 EDT 2002 | Juan C. Ruiz
Do you have any picture or reference how can we determine black pad or plating contamination. I have heard about a lot of problems regarding BGA's and normally these components are only replaced or heat it and that's it ,after that the boards are wor
Electronics Forum | Wed Oct 09 12:29:14 EDT 2002 | ppcbs
We have been encountering black pad contamination on gold plated boards mainly affecting BGA components during assembly. This problem has been noticed with many of our customers that are using an array of fab vendors. Does anyone have a solution fo
Electronics Forum | Fri Sep 26 07:26:33 EDT 2008 | realchunks
Looks like lack of wetting. What is the BGA ball material? Could be high temp. Could be improper profile. Could be paste sat on board too long / flux dryout. Could be co-plane mount and this ball touched at the end of reflow curve. Could be cont
Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York
Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form
Electronics Forum | Fri Jul 21 12:15:52 EDT 2006 | CKH
Hi Folk, every now and then, i would encounter Functional Failure due to BGA ICs. The Testing Tech always conclude that the contact of the BGA to the PCB Pad is poor. The 2D/3D X-ray machine can't detect any of the poor contact on the BGA..... We
Electronics Forum | Tue Jul 07 05:55:34 EDT 2009 | kpm135
I agree with your assessment of the two pins with irregular solder. The head-in-pillow or broken joint are both probable events for your defect. At this point in the process it will probably be difficult to pinpoint the exact cause. If it was a broke
