Electronics Forum: bga cpu (Page 1 of 2)

BGA Head-in-pillow Defects

Electronics Forum | Mon Aug 25 06:43:37 EDT 2008 | callckq

Dear All, Recently, we found a strange defect called "Head-in-pillow" defect at CPU socket BGA. The strange thing here is that this problem only appear on that CPU socket BGA and not on the others BGA which were also mounted on the PCB. We suspect

removing glued chips

Electronics Forum | Sun Jun 05 13:42:16 EDT 2005 | amigo

We find it impossible to remove the glued micro-BGA chips like the CPU and the UEM ICs used in Mobile Phones. They are both surface mount devices and glued with some chemicals we think. Any help is most needed in this matter.

BGA drop off from the boards

Electronics Forum | Fri May 23 00:16:31 EDT 2014 | edriansyah

Hello all. I need you advice and opinion on my problem with BGA drop off from the boards. Initial defect was ICT fail, but due to some accident, the board fell off, and the BGA just pop out. After some search, I end up to conclude it is a black pad

reflow CPU Socket Open Joint boards again

Electronics Forum | Wed Jul 26 12:39:00 EDT 2006 | spari77

we encounter some open joint on the CPU socket after rework. We tried to reflow the boards again (using BGA rework machine) and found that the contact issue was resolved. Is there any risk to perform a reflow again on the CPU Socket boards without re

Ceramic BGA Balls Move Post Assy

Electronics Forum | Wed Aug 15 08:33:31 EDT 2012 | jdumont

Wondering if anyone has ever run across this in their travels. We have gotten a few field returns back in recent months and it appears that many of the balls of the PPC440 CPU BGA (ceramic) have shifted. I know we Xray this part 100% during assy so

QFP208-Leads for MCM-L?

Electronics Forum | Fri Apr 17 21:46:18 EDT 1998 | Matthias Mansfeld

I plan to design a multichip module which contains 1 chip with about 200 pads and 2 chips with about 50 pads, no other components.The whole module shall replace as intermediate solution a single chip CPU in QFP208. Thus, the MCM itself must have t

Re: Criterion of PCBA bending degree

Electronics Forum | Fri Jun 11 01:40:40 EDT 1999 | Gyver

| | | Hello all! | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it'

Re: Criterion of PCBA bending degree

Electronics Forum | Fri Jun 11 03:39:26 EDT 1999 | Gyver

| | | | Hello all! | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt

Re: Criterion of PCBA bending degree

Electronics Forum | Fri Jun 11 04:38:05 EDT 1999 | Gyver

| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: Criterion of PCBA bending degree

Electronics Forum | Mon Jun 14 09:16:58 EDT 1999 | Adam Pratt

| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

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