Electronics Forum | Thu Dec 07 14:23:30 EST 2006 | russ
I wuld say it is attachment method and post install force that is the problem not the size of the heatsink. we place heatsinks that are at least 5 times the size of BGA with no issue, they are attached with very precision torque drivers. Russ
Electronics Forum | Wed Sep 09 11:17:09 EDT 2009 | clampron
Hello Radek, Does a new (unbaked) BGA exhibit the same crack? If so, adress this with the manufacturer. If not, what are your baking parameters? Chris
Electronics Forum | Fri Sep 04 02:27:48 EDT 2009 | hurr
Hallo all, when I remove one from us malfunction BGAs from PCB I saw under X-ray inspection inner hairline crack.(see fig.1.) BGA was dried according to J-STD 033 and reflowed in lead process. When I look at new (baked BGA) under X-Ray inspection I
Electronics Forum | Thu Feb 21 16:28:44 EST 2002 | Dave G
Sounds like the Infamous "Black Pad" Phenomenon to me. A search through the Archives should bring up lots of stuff. DG
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Fri Feb 22 08:26:51 EST 2002 | davef
You are correct. The gold dissolves in the solder. The gold is meant to protect the nickel from oxidizing, so that you can solder to the nickel. Obviously that didn�t work as planned. Your background information is very sparse. Two things come
Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef
This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold
