Electronics Forum | Tue Jun 09 12:08:34 EDT 2020 | dontfeedphils
Any reason you're doing a RSS profile rather than a RTS?
Electronics Forum | Sun Jun 14 13:16:10 EDT 2020 | davef
Where are HIP connections located?
Electronics Forum | Fri Jun 12 05:56:53 EDT 2020 | sssamw
I cannot see the logic connection between HIP and RSS or RTS, or between HIP and solder paste volume because volume is ok. Did you measured the BGA solder profile?
Electronics Forum | Wed Jun 10 04:00:46 EDT 2020 | ameenullakhan
Hi Phil, we used RSS profile initially , because of tombstone issue at 0201 package. We are planning to reduce soak a now to have flux till the end of reflow to avoid HIP now. and to support that . we are increasing over aperture opening also. Re
Electronics Forum | Tue Jun 23 13:23:55 EDT 2020 | emeto
If you swear in having consistent print, I bet you it is the part. Some of these BGAs probably have missing or inconsistent balls.
Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan
Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Thu Dec 05 05:39:05 EST 2019 | oxygensmd
I know your application isn't BGA but the data sheet also mention about the peak temperature - 235 Celsius. For the LEDs you can reach higher temperature and I recommend to reach 225-235 Celsius. You will get significantly better results because the
Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr
Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.
Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
