Electronics Forum | Fri Jul 23 01:03:28 EDT 1999 | KYUNG SAM PARK
HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 manufactured by 0.k international ] ��DESOLDERING HEAT ��IRON TIP TEMP : 350-370��(MEASURED) ��REBALLING
Electronics Forum | Fri Jan 21 19:30:11 EST 2005 | Dreamsniper
Hi T2, The purpose of this is that we want to make our rework robust. Whenever we rework BGA's we have solder getting trapped into those 1 sided tented vias and bet yah...they are hard to desolder! And during BGA resoldering these trapped solder will
Electronics Forum | Mon May 12 16:31:39 EDT 2008 | tsvetan
Hi, there are different BGA packages, it's not same to rework LFBGA with 0.5 mm step and BGA with 1.27 mm step for instance basically you will be able to de-solder the BGA with hot air and proper nozzle which distributes the heat even on the BGA pa
Electronics Forum | Mon Jan 05 03:12:54 EST 2009 | lococost
If you can use a IR desoldering station, you could try covering the second BGA with aluminum tape. The tape shouldnt touch the second BGA, it should form a 'roof'over it that reflects the IR waves.
Electronics Forum | Fri Jul 23 01:32:21 EDT 1999 | KYUNG SAM PARK
HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED BY
Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs
What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ
Electronics Forum | Tue Jan 11 11:14:09 EST 2000 | Wolfgang Busko
What a challenge! I think it all depends on the equipment used. Seems rereflow of BGA isn�t that good (see the advices for wavesoldering BGA populated boards). Although you might check for the tacking force by sending a sample BGA board head over thr
Electronics Forum | Mon Aug 23 16:37:22 EDT 2004 | Terry
Three methods, all work, all require generous use of flux. 1.) Use a heated, electrical desoldering tool with flux. Just be sure that you select a forgiving desoldering tip with a rounded tip end to it so that you do not scratch the pad. Advantage:
Electronics Forum | Tue Jun 26 15:36:57 EDT 2007 | bjrap3
The board thickness is 50 thousandths. The style of the BGA is a 324 ball BGA that has an isolated center region. The machine that I am using is the Air-Vac DRS25. I'm not too sure why the pads are being removed when I am desoldering. I know when
Electronics Forum | Tue May 23 11:06:53 EDT 2000 | Michael Parker
Kathy- Greater than 88%. Is that 3-D Nicolet? I had a conversation with Arline yesterday, she told me about your trials and tribulations with re-balling. I would like to suggest you try micro-stencil instead. If your BGA rework center has the capabi
