Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Mon Oct 02 20:17:38 EDT 2006 | davef
The different coefficient of expansion of materials used in some BGA can cause warping issues. We've talked about this previously on SMTnet. Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=2
Electronics Forum | Tue Sep 26 16:44:18 EDT 2006 | df
All, We have a board that has failed at burn in. There is a 672 BGA on the board. When the test guy presses down on the BGA the board will pass ! What am I looking at here? Board finish is ENIG - could this be black pad / what should I do to diagn
Electronics Forum | Tue Sep 26 18:06:13 EDT 2006 | russ
could be black pad, or it is just bad reflow profile that did not get all balls soldered down. OR it could be a planarity issue between BGA and fab during assembly. Can we assume that this is proven design? Somewtimes in new design touching a BGA
Electronics Forum | Mon Oct 02 19:04:53 EDT 2006 | DC
We had a issue on the SBGA and found stress built up at the corner of the SBGA after cool down to room temperature. It is confirmed by the warpage analysis. I expected that the stress caused by the heat spreader and the epoxy to the copper frame. O
Electronics Forum | Tue Sep 26 18:29:15 EDT 2006 | stepheniii
Profile, profile, and profile. If you can sacrifice a board, the best is to drill a small hole into the a ball from the other side of the board and insert a thermocouple there. I'm 99.99% certain you won't be able to sacrifice a board. (who can the
Electronics Forum | Wed Oct 02 15:08:37 EDT 2002 | Eric
See Fiske first line. I'd bet You are bending or catching the assembly in the ICT. How many probes at 8OZ each? do you use on that ICT? 800 probes = 400lbs. See "Flexure induced failure of BGA solder joints" by Compaq Houston TX
Electronics Forum | Wed Sep 30 14:17:06 EDT 2009 | davef
What does failure analysis of the BGA indicate? Is this: * ESD damage * Open circuits * Shorting What's the problem?
Electronics Forum | Thu Oct 01 03:03:29 EDT 2009 | cunningham
what we are getting is open circuits not every BGA is failing we use Humiseal 1A33 and currently there is no masking instruction for around the BGA
Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton
We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac
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