Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Wed Oct 02 15:08:37 EDT 2002 | Eric
See Fiske first line. I'd bet You are bending or catching the assembly in the ICT. How many probes at 8OZ each? do you use on that ICT? 800 probes = 400lbs. See "Flexure induced failure of BGA solder joints" by Compaq Houston TX
Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton
We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac
Electronics Forum | Mon Mar 21 12:34:58 EDT 2011 | scottp
If there was a ball in cup defect on the original assembly then it could behave like you explained.
Electronics Forum | Mon Mar 21 23:10:13 EDT 2011 | kemasta
Hi Scott Thank you very much.
Electronics Forum | Wed Sep 30 14:17:06 EDT 2009 | davef
What does failure analysis of the BGA indicate? Is this: * ESD damage * Open circuits * Shorting What's the problem?
Electronics Forum | Thu Oct 01 03:03:29 EDT 2009 | cunningham
what we are getting is open circuits not every BGA is failing we use Humiseal 1A33 and currently there is no masking instruction for around the BGA
Electronics Forum | Thu Oct 28 13:36:14 EDT 1999 | Bart Smith
I am a design engineer and have a circuit board design with a 292 pin BGA on it. The board manufacturer is experiencing a failure rate of about 2.8% on the BGA device due to soldering problems. This is my first experience with BGA. How does the 2.
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Mon Oct 02 20:17:38 EDT 2006 | davef
The different coefficient of expansion of materials used in some BGA can cause warping issues. We've talked about this previously on SMTnet. Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=2
