Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Wed Nov 21 04:46:27 EST 2001 | emmanuel
Yes, i confirm you that the BGA i'm refering to are Motorola BGA. The fractures that appear after 500 thermal cycles (-45�C/+125�C) are located in the solder joint/pad connection. We have been asked if this fractures are due to BGA & PCB design or to
Electronics Forum | Tue Feb 10 22:20:16 EST 2009 | stevek
Looks like an improvement to the spinning stuff, but gads, I wish these people would stop using the term slice. The Teradyne still does not create a slice. It infers things from different sized shadows. It still cannot actually image a slice thoug
Electronics Forum | Wed Sep 30 11:32:45 EDT 2009 | pbarton
What type of conformal coating are you using and are you allowing the coating to migrate under the device in question? If you are allowing the coating unbder the BGA the problem could be CTE of coating is much greater than that of the BGA balls/sold
Electronics Forum | Tue Aug 13 01:44:19 EDT 2002 | kenbliss
This problem is the number one reason the electronics industry has moved the handling process of PC boards to the tray and tray cart handling process. It eliminates flexing of boards and therefore stops board damage ie. broken circuits and micro fra
Electronics Forum | Fri Feb 01 14:23:47 EST 2002 | delnosa
Looking for help on getting information on understanding the physics of micro-fracture growth rate within the BGA ball (or solder joints in general). Hoping to find a fairly straight forward study on the concept/theory of this topic. I'm not a meta
Electronics Forum | Tue Apr 01 08:59:06 EST 2003 | rdr
Hi all, I've got a question that hopefully someone can provide insight. We have a gold immersion assembly that we believe is experiencing fractures or non wetting on a certain BGA. To be sure that it is a fracture and not a wetting issue I would li
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette
I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho
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