Electronics Forum | Tue Feb 02 13:55:52 EST 1999 | Brian Stumm
| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | | Al, From my experience BGA's are no more difficult to profile than any other component.
Electronics Forum | Thu Jan 07 12:30:32 EST 2016 | unisoft
> Unisoft ProntoPLACE software ( http://www.unisoft-cim.com/pcbplace.htm ) >> ProntoPLACE programs popular surface mount (SMT) placement, through-hole (THT) insertion and glue dispensing machines. Universal, Fuji, Mydata, Siemens, Panasonic, Assembl
Electronics Forum | Thu Jan 07 12:31:36 EST 2016 | unisoft
> Unisoft ProntoPLACE software ( http://www.unisoft-cim.com/pcbplace.htm ) >> ProntoPLACE programs popular surface mount (SMT) placement, through-hole (THT) insertion and glue dispensing machines. Universal, Fuji, Mydata, Siemens, Panasonic, Assembl
Electronics Forum | Thu Jan 07 12:32:41 EST 2016 | unisoft
> Unisoft ProntoPLACE software ( http://www.unisoft-cim.com/pcbplace.htm ) >> ProntoPLACE programs popular surface mount (SMT) placement, through-hole (THT) insertion and glue dispensing machines. Universal, Fuji, Mydata, Siemens, Panasonic, Assembl
Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Thu Jun 03 14:40:22 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
Electronics Forum | Thu Jun 03 14:41:06 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
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