Electronics Forum | Tue Jul 02 12:10:06 EDT 2002 | fmonette
Dason, Just a word of caution about your experiment. Evaluating moisture content by weight gain is a very simplistic model, based on the assumption that the moisture content is uniform across the package. In fact, recent technical papers have cl
Electronics Forum | Thu Jun 20 15:50:04 EDT 2002 | dason_c
Dave mention b/4 to me, we don't have any industrial standard for the BGA rework. One of my customer request us to bake at 125C for 6 hours b/4 rework. I am lucky and we don't have the component which you are using. I did a evaluation and we found
Electronics Forum | Sun Aug 02 20:31:22 EDT 1998 | karlin
Hi Bob, The weight of the TBGA is heavier then PBGA due to the Stainless steel heat sink. I have tried run them through the oven without paste. Due to the high lead content( 90Pb/Sn10), the "solder: did not melt. Still see the misalignment issue but
Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef
BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr
Electronics Forum | Sun Aug 02 12:24:23 EDT 1998 | Bob Willis
Sorry all the parts I have processed are just like standard BGA just swing back into possition unless they are placed off the pads and touching the next pads. All my parts have had heat sinks and are the same weight as PBGA. Are your parts light. If
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Tue Jul 02 17:09:02 EDT 2002 | dason_c
Francois, thank you very much for your recommendation twice. Is it any harmful for my evaluation? The component will go thro the reflow after drying process and not just only check the weight. The evaluation will go thro the C-SAM as Dr. Shook doc
Electronics Forum | Wed Dec 30 09:09:42 EST 1998 | Earl Moon
| | | | | | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | | | | | | | | | Is there any one who has been running this process in production
Electronics Forum | Wed Oct 03 23:58:23 EDT 2018 | gaintstar
Flason SMT News: http://www.flason-smt.com/new/6-Things-to-Check-Before-Submitting-Your-PCB-Design-for-Manufacturing.html http://www.flason-smt.com/new/about-wave-soldering-machine-tin-pot.html http://www.flason-smt.com/new/Advantages-of-Design-for-
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