Electronics Forum | Fri Apr 02 04:02:18 EDT 2010 | manju2cool
Hi, I think concept of inspection through AOI is changing. I am struck in confusion.Because some manufacturer say 3D inspection, with 1+4 cameras is ultimate solution. Orbotech also came with 13 cameras at once!Now some say, all these are eyewashing
Electronics Forum | Fri Apr 02 14:11:21 EDT 2010 | bigdaddysoy9
Manjunath, I prefer orthogonal systems. In my experience they are actually better at detecting coplanarity and HIP defects than multi camera systems. They are obviously limited, in that they can not inspect a component under another component, b
Electronics Forum | Fri Apr 02 10:26:13 EDT 2010 | fishingfool
Manjunath The top camera will be used for probably 90-95% of your inspection needs. However, without side cameras that 5-10% of uninspected parts can be a real pain to manually verify. What you need to figure out is what is your product to inspe
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Fri Sep 17 13:26:43 EDT 1999 | The Guc
| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine
Electronics Forum | Mon Jul 12 13:02:38 EDT 2004 | jasont
anybody doing bga placement w/Fuji IP2? what is required if it is possible (camera, nozzles, s/w, etc.), thanks
Electronics Forum | Tue Jul 13 00:40:44 EDT 2004 | Darren
Yes of course we are doing placement of BGA's with an IPII. However there is no front lighting so you can not inspect the balls. If the silhouette is square enough there is no problem with alignment. Just use the largest nozzle that will fit on the p
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Wed Feb 05 08:51:13 EST 2014 | emeto
What I think it does is to calibrate the camera. You have your tube on the bottom and your camera on the top. For my machine(Dage) I have to put the board I am going to examine inside and select a point on the board surface. THen I just click on this
Electronics Forum | Mon Feb 14 14:59:44 EST 2000 | hany a. salam
Hello there: We urgently need a 45mm FRONT CAMERA to be installed on a Philips pick & place M/C. The M/C model is EMERALD & it is one of the GEM line series. The camera should manage to visualize the BGA components. Please if anyone can give a hand
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