Electronics Forum: bga insufficient (Page 1 of 6)

Re: BGA open

Electronics Forum | Thu Sep 02 11:50:58 EDT 1999 | ScottM

| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Insufficient solderpaste. "No flux" (sat too long after print). Those are what I've experienced. Cheers, Scott

Re: BGA assemble

Electronics Forum | Fri Oct 06 08:22:05 EDT 2000 | jackofalltrades

BGA's are not difficult, but should be inspected no matter how careful you are. Here we have been doing bga's forever and x-ray 100%. Without an x-ray there is no good way to ensure the BGA is placed properly, without bridging or insufficients. If yo

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro

Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 08:33:53 EST 2000 | Tony Di Mauro

Kurt, When I was working in a captive manufacturing house we had been to migrate toward tenting all vias under the BGA to eliminate not only shorts but insufficient (Starved) joints. Tony

Re: BGA open

Electronics Forum | Thu Sep 02 21:19:25 EDT 1999 | NAZEEH CHAUDRY

| | Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | | | | Insufficient solderpaste. "No flux" (sat too long after print). | | Those are what I've experienced. | cbga or pbga if pbga check thermal prof

BGA rework with unplugged vias PCB

Electronics Forum | Thu Dec 07 00:55:51 EST 2006 | billylim

As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with SRT rework machine. The problem we have with

Reflow PBGA

Electronics Forum | Wed Jun 26 11:44:06 EDT 2002 | jseagle

Steve, We do not currently run BGAs, but I have been told by a CM we use that does BGAs, that our Heller 1500 (5 zone) oven has an insufficient number of zones to properly reflow a BGA. Anyone else have an opinion about this it would be appreciated

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak

Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak

Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit

BGA placement on PGA

Electronics Forum | Thu Nov 07 15:55:30 EST 2002 | Debi Musante

The XRAY looked okay with minimum voids throughout. Customer reports insufficient contact causing intermitten failures.

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