Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Fri Mar 27 10:16:33 EDT 2015 | dyoungquist
A good resource for implementing/evaluating a BGA process is IPC-7095C - "Design and Assembly Process Implementation for BGAs". I get no monetary or other compensation for promoting that standard but it is fun to mention that a board assembled by my
Electronics Forum | Thu Mar 26 19:13:15 EDT 2015 | vladig
Right. That's what we normally do for our customers in order to just qualify a process. I'd just add X-ray, particularly on a large BGAs. Regards, Vlad SENTEC TESTING Laboratory Inc.
Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano
Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Fri Mar 27 05:11:24 EDT 2015 | robertwillis
If you want a step by step guide on BGA look at my NPL/IPC "Defect of the Month" video clips https://www.youtube.com/watch?v=MC4K0eSXH18 For other process issues there are also videos which may assist on other process issues like voids, solder ball
Electronics Forum | Thu Aug 27 16:03:20 EDT 2009 | jim_n_hky
We recently had a very similar issue with BGA breaking off at the pad. We sent samples to a lab for SEM / EDX and they found that there was no intermatalic with the nickel, or very little do to high phosphorus. I recommend you get a board to a lab AS
Electronics Forum | Sun Jun 12 09:29:41 EDT 2016 | davef
I'd guess that the interconnect pads on the BGA have poor solderability. Confirm this with testing at an independent lab. Work with your supplier to resolve the issue.
Electronics Forum | Thu May 16 02:47:17 EDT 2019 | Joy
For lab, the bga rework station should with good quality, good brand have nice service, for machine, should use it more than 8-15years, the brand what you writen is good brand, but i still reommend zm r7850A BGA rework station for you, this machine c
Electronics Forum | Tue Sep 25 23:09:23 EDT 2018 | franknguyen
Hi, We are PCBA production company which factory's located in Vietnam. Somtime, we have to analyse failure of product to find out the root cause (ex: Micro-crack of solder joint under BGA IC...). We are searching labs around Asia (Vietnam, Malaysia,
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