Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Thu Sep 02 15:50:30 EDT 1999 | R Scheller
Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? What I'm really after is anything describing how close a screw/washer/nut combination which
Electronics Forum | Thu Sep 02 16:06:33 EDT 1999 | Earl Moon
| Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | What I'm really after is anything describing how close a screw/washer/nut combination
Electronics Forum | Thu Sep 02 16:37:23 EDT 1999 | R Scheller
| | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | What I'm really after is anything describing how close a screw/washer/nut combin
Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon
| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Sat Feb 14 13:28:47 EST 1998 | ASHOK DHAWAN
I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The IPC
Electronics Forum | Mon Aug 11 07:27:32 EDT 2008 | eyalg
We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress wa
Electronics Forum | Sun Feb 15 18:07:18 EST 1998 | Scott McKee
| I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The I
Electronics Forum | Thu Sep 07 11:01:52 EDT 2006 | davef
BGA cracking is caused by mechanical stress. This may be the result of: * Rough handling of soldered board * Inadequate consideration during package design of CTE effects on BGA * Poor control of or selection of thermal ramp rates during soldering
