Electronics Forum | Thu Sep 18 14:32:36 EDT 2008 | jwentz
Ditto, we just went through this with a customer "fitting" our boards into a card cage. Mechanical stress/flexing.
Electronics Forum | Thu Sep 07 10:18:24 EDT 2017 | capse
Chrys Shea has published extensively on stencil materials, coatings and paste release mechanisms. Many of the papers are available to download on her website. Just search for Shea Engineering Services. I've worked with Chrys in the past, she is defin
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
Electronics Forum | Thu Mar 01 19:27:48 EST 2007 | Wayne
Yes, I am currently using Viromet 347 at the moment for my SMT lines. 100-150, 35 sec 150-207, 40 sec 207-above, 80 sec peak temp: 225 deg C. It is compatible to SAC paste in term of solderability and wettability. But in term of mechanical property (
Electronics Forum | Thu Jul 18 17:41:31 EDT 2019 | rgduval
The UFP was a designation for "ultra-fine-pitch"; but, for the most part, you should be able to get the same placements out of both machines. Anything 0402 or above can be mechanically centered. The UFP machine will lean on optical centering for .5
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Mon Dec 28 10:17:09 EST 1998 | Earl Moon
| Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be help
Electronics Forum | Tue Jan 05 13:26:13 EST 2021 | ppcbs
We are working to upgrade our BGA Rework Systems to place BGA's up to 150mm in size. We are encountering an issue that I wanted to pose to this group. When we get above 50mm in chip size, which is the field of view for the vision systems Prism, the
Electronics Forum | Sat Feb 03 20:30:07 EST 2001 | Robert
James, if you want to get a circuit board wet, then any cleaner will do. Tighter componentry and BGAs are different. Even if you submerge a BGA, the surface underneath it will not be effected. Thus you need to force the chemistry mechanically unde
Electronics Forum | Thu Nov 05 13:00:27 EST 2009 | swag
The solder joints might hook up but my opinion is you'll end up with mechanically weak joints that could fail over time. If your trying to get your Xbox back on-line at home I'd try it but not if your charging $ to fix it for someone else or re-work
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