Electronics Forum: bga mechanical (Page 6 of 16)

Re: Mydata placment reliability

Electronics Forum | Tue Jul 07 15:47:22 EDT 1998 | Joe Herz

| Any Comment's about mydata placment reliability (repeatablity) on all types of components. | we have trouble quantifying just how good it is. | Is it as good as Mydata Claim ?? | Please help We have 4 Mydatas running at this time. Non vision par

Re: Mydata placment reliability

Electronics Forum | Tue Jul 07 15:51:08 EDT 1998 | Joe Herz

| | Any Comment's about mydata placment reliability (repeatablity) on all types of components. | | we have trouble quantifying just how good it is. | | Is it as good as Mydata Claim ?? | | Please help | We have 4 Mydatas running at this time. | No

Decapsulator

Electronics Forum | Thu Sep 24 22:30:23 EDT 1998 | Hank Hsiung

Dear Friends, I am looking for more information on plasma decapsulator for failure analysis of COB and BGA. So far I know only one manufacturer-Nippon Scientific who produce this machine. Have any of you used their machine? What is your opinion on

PCB baking for rework

Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg

What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often

Zevatech 720

Electronics Forum | Thu Dec 12 00:36:11 EST 2002 | Frank

We had one of these years ago. We had trouble with it recognizing fiducials consistently, but other than that it ran good. This assumes that the left head, which is mechanical centering, is working good. And I believe that the minimum component

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

BGA dropping off the board

Electronics Forum | Thu Feb 14 07:34:10 EST 2008 | jdumont

How many fell off out of your entire lot? What was the soldering quality like on the ones that didn't fall off (xray, visual)? You need to determine if its a random problem or if even the ones that stayed on are barely on and go from there. If the o

BGA epoxy removal

Electronics Forum | Wed Mar 25 03:27:13 EDT 2015 | slave2anubis

Hi davef, thank you for sharing this. Yes all manufacturers recommend their products, and i dont deny that they are good but for a small shop like i have i think the prices are a bit high. What i think would be a good technique, is heating the area t

Solder Ball Attach (BGA)

Electronics Forum | Fri Sep 28 01:47:46 EDT 2018 | netvicher123

The followings may be the factors from your description: 1. chain speed and motor speed? 2. is the tin content even? (more or less on one side, or thickness of steel mesh, size of opening) 3. Is there any exception in the pin? 4. is there any level

Re: IPII v.s IPIII

Electronics Forum | Thu May 18 23:22:44 EDT 2000 | Micah Newcomb

Jerry, Contact FujiAmerica and ask for their newest product Guide. Some differences are..... IP2 - SMD1 vision (back lighting only, coplanarity check optional) IP3 - SMD3 vision (back, front, coplanarity check optional) IP3 - BGA transport, I


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