Electronics Forum: bga mechanical (Page 10 of 16)

Re: Suspect BGAs

Electronics Forum | Tue Mar 16 18:27:34 EST 1999 | Earl Moon

| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it

Unusual board with BGA

Electronics Forum | Fri Dec 21 15:32:57 EST 2007 | rwyman

Hey SWAG- Not an uncommon scenario where I'm at. But the bottom line is, as others have said: Profile, profile, profile. Here, we have dedicated profile boards for each product we build and in most cases they're EXACT representations (my library i

PCB Trouble shooting Lab

Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL

With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Wed Feb 03 18:32:07 EST 1999 | Earl Moon

| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen

Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). | | I'd like to find some t

Voids in grounding pad of RF PCB

Electronics Forum | Fri Aug 02 12:07:50 EDT 2002 | johnw

Richard, your asking a multi million dollar question that in my own opinion no one can give you the right answer since no one really knows. hence I think the lack of answers to your question....thought there would be more people willing to propose a

Cleaning Water Soluble Flux under BGA's

Electronics Forum | Wed Mar 24 21:51:23 EST 2004 | davef

Dreamy It sounds like you are having fun in your new job. Saponifier. Alkaline chemicals, added to water, that convert rosin/resin flux residues in the water to soluble soaps. Generally, saponifiers are better if used in an aggressive spray-in-ai

Black pad on BGA after removal

Electronics Forum | Thu May 05 09:46:04 EDT 2005 | davef

Board fab, Defects, Pad coatings, Gold black plague articles 1 Nick Biunno's article: http://www.nukcg.org/downloadfiles/Hadco%20on%20Immersion%20Gold%20failures.pdf 2 George Milad's article: http://www.circuitree.com/ct/cda/articleinformation/featu

MYData placement variations

Electronics Forum | Wed Feb 21 06:11:41 EST 2007 | CL

Good Morning, We have 5 Mydata MY machines in separate lines. We are placing 0201's, uBGA's, CSP's, etc.... I cant say that we have never had accuracy problems but whatever caused the problems was identified and they are fairly accurate as far as I'

Hidden Pillow Phenomenon

Electronics Forum | Tue Nov 14 21:27:26 EST 2006 | davef

"Hidden pillow" seems to be a a variant of "pillow effect" or "head in pillow". Pillow effect is an open, with non-wetting between the lead and the solder on the pad. Here the lead sags into the solder without any bonding or wetting. Poor wetting c


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