Electronics Forum | Thu Nov 08 12:50:22 EST 2012 | jmartens1978
I have a project that I am working on and would like some input from anyone that has some knowledge on High Voltage Arcing on PCBs. Problem: I have a PCB that is enclosed in a plastic enclosure that has metal pins and switch that extend to the outs
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component
Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon
| | | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be
Electronics Forum | Mon Jun 08 11:39:28 EDT 1998 | Earl Moon
| How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr
Electronics Forum | Thu Sep 03 13:49:30 EDT 1998 | Earl Moon
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Wed Sep 09 01:28:33 EDT 1998 | John Godfrey
| | I am in need of possible causes and solutions to capacitors that are failing in the field. | | Are there issues in our process that need to be | | checked? | | Some people said the problems are due to improper | | storage. Others say it is th
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
Electronics Forum | Thu Jan 19 06:25:42 EST 2006 | bwet
There are several life studies (see for example http://www.solder.net/stencilquik/articles.asp) which point to higher reliability of reworked BGAs using solder paste vs flux. The theory on the mechanisms which allow this to happen are as follows: 1
Electronics Forum | Fri Oct 09 13:37:55 EDT 2009 | tstrat
We are seeing similar issues. We have a board that consistently has failures on a BGA part. After SEM/EDS it was shown that the fractures were occurring between the Ni-P and Ni-Sn intermetallic in the ENIG finish. The element map showed elevated conc
