Electronics Forum | Tue Apr 23 14:30:35 EDT 2019 | scotceltic
I would like to setup a guideline for BGA to components around it minimum distance. To allow for rework possibilities of the BGA. What are people using as a minimum clearance out there ?
Electronics Forum | Wed Oct 06 17:50:00 EDT 2010 | jamyboy
IBM Intel motorola did exhaustive studies on this and found that the best thing to do is (as others pointed out) the PBfree BGA reaches 217 minimum and the time above 217 must be extended to allow mixing of the 2 alloys. See attached a little diddy
Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef
What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?
Electronics Forum | Wed Sep 21 01:57:40 EDT 2005 | hly
Hi K, Thanks for your reply. I was wondering if there is an industry spec that specifies a minimum required solder volume for BGA joints? Thanks HLY
Electronics Forum | Tue Nov 16 09:37:53 EST 1999 | Ted C
Is anyone out there using automatic despensing equipment rather than stencils for depositing paste on BGA patterns prior to placement/repair. What is minimum dot size that can be reliably applied. Pro's/con's?
Electronics Forum | Tue Jun 01 17:37:34 EDT 2004 | lynnmc
Any view on what the minimum reflow temperature is for a SAC ball bga to form a reliable joint with PbSn solder?
Electronics Forum | Wed Aug 29 09:01:14 EDT 2001 | stefo
Steve, Go to: http://www.sixsigmaservices.com/services.htm They can do it, or you can buy the "solderquik" bga preforms and do it yourself. They have a $50.00 minimum lot charge if you have them do it... -Steve Gregory-
Electronics Forum | Tue Feb 25 20:10:33 EST 2003 | davef
First, there is no standard. Next, on one hand, most BGA cost a lot of money. On the other hand, choosing to use reballed BGA in products for shipment depends on how well you expect to meet your customers' expectations about product reliability wit
Electronics Forum | Tue Jul 24 09:15:47 EDT 2001 | gdstanton
Folks, Does anyone have data to support that a minimum clearance left around the perimeter of a BGA on a board design can improve its solderability? In other words, if X distance is left open (free of components) around the BGA, could ball solderab
Electronics Forum | Tue Mar 28 15:11:56 EST 2006 | GS
Hi MLC, did you profiled the BGA itself? I mean detect Temperatures on middle/central ball vs external ball and see how much is the delta Temperature. Best practice is to keep the delta T at minimum as possible especially on a so large BGA. Sure
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