Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Fri Mar 23 03:18:08 EDT 2018 | bukas
hello Diego, I would start by opening oven and looking for missing components. once you locate them you can work from there. are you using any alu caps on your board? I had problem with bad alu caps exploding in oven and scattering other components.
Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Tue Apr 16 13:59:33 EDT 2002 | paulausten
They work great as long as your conveyor speed > has been calibrated and checked on some type of > PM schedule. On some oven types these sensors can > warn you to possible problems with the conveyor > speed. Say the oven is calculating that the b
Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell
| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus
Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon
Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t
Electronics Forum | Tue Aug 04 14:29:14 EDT 2020 | dwl
Is the component an LGA or BGA? If its a BGA, it appears like the component is missing balls, if its an LGA, it appears like the solder isn't wetting to the component. What solder are you using? The wetting to the larger pads in the last pic seems
Electronics Forum | Fri Aug 07 03:16:33 EDT 2020 | rsatmech
It's a BGA component. Missing ball is not possible because we have enabled the vision in pick and place. Solder paste is OM353 type 5 Possibilities of Flux dry before reflow seems valid but I saw the board data it was completed on time like other
Electronics Forum | Fri Oct 09 02:54:57 EDT 2009 | omid_juve
Dear sir`s i want to place one TBGA144 with DRS24 rework station i use many different profile but with near all of them in the ramp stage and reflow stage the balls of the BGA thrown away from the part and cause many short circuit under it and also m
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