Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Thu Jan 27 07:18:14 EST 2000 | Christopher Lampron
Dennis, The solder paste is responsible for holding the component in place pre-reflow. Several things to look at: Is the paste accurately printed on the pad? If not, there may not be enough of the component in contact with the paste to provide adiq
Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell
| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus
Electronics Forum | Tue Sep 16 19:16:11 EDT 2008 | hegemon
Hello everyone! > > I'm a student of electrical > engineering currently working on a thesis for my > BSc degree. It will be about post reflow AOIs and > AXIs, and I'd kindly like to ask you for some > help with it. > > I would like to know if t
Electronics Forum | Tue Sep 14 13:38:33 EDT 2010 | rayguide
There is problem with the alignment of BGA Balls. Check for any vibration. http://hubpages.com/hub/SMT-Reflow-Soldering-Equipment
Electronics Forum | Thu Nov 29 13:22:39 EST 2018 | roblackey
Hi Evtimov, For BGA's you place 4 on each side right outside the edge balls and it pulls the case down and a bit is pulled between the balls on reflow. Not tried gluing a crystal (they only gave me a strip to play with)
Electronics Forum | Fri Sep 10 17:18:10 EDT 2010 | spitkis2
They may be misaligned so much so that self centering would not occur. How are you placing the micro BGA's? Depending on how the boards are transported onto the oven's conveyer, by the time they start to go through the oven, there could be additio
Electronics Forum | Tue Sep 14 17:08:58 EDT 2010 | daxman
Hi, Do you have an Xray machine? we've had similar problems with micros in the past. I'd place one on double sided tape and x-ray to ensure that it is centered. If it is, i'd look into other issues such as vibration or speed of the PCB in the machin
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