Electronics Forum | Mon Jun 02 16:33:35 EDT 2008 | operator
Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of
Electronics Forum | Fri Dec 27 14:11:18 EST 2002 | cnotebaert
We have placed these parts. I have not had problems with them but when I designed the stencil we reduced the app for the large thermal by 20% to reduce the chance of problems like your having. If the balls are close (.040-.050" or
Electronics Forum | Mon Jun 02 19:41:41 EDT 2008 | operator
Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of
Electronics Forum | Tue Jun 03 12:49:29 EDT 2008 | operator
If only my company would pay for a membership to IPC......
Electronics Forum | Wed Jun 04 00:13:18 EDT 2008 | operator
Very informative article. Thanks Dave.
Electronics Forum | Tue Jun 03 22:54:54 EDT 2008 | davef
This might be a good starting point for you: http://pcdandf.com/cms/content/view/3760/95/
Electronics Forum | Tue Jun 03 12:29:58 EDT 2008 | slthomas
We don't build anything with BGA yet so don't have this standard but IPC-7095B, Design and Assembly Process Implementation for BGAs would be a good place to start. I don't know for a fact that it contains info. that applies specifically to your iss
Electronics Forum | Tue Jun 03 13:25:46 EDT 2008 | slthomas
I'm in the same boat and have to pay a little more for the standards I insist on having. You just have to work on your sales pitch a little to convince the powers-that-be that you need it. Just tell them the difference is about $50k/year in scrap and
Electronics Forum | Wed Mar 03 05:07:06 EST 2004 | Javi
Hello, I would like to design the thermal reliefs/pads of my through-hole components. I would appreciate any info, doc or link about how design them (dimensions, slit width, circular or square, etc). Thanks a lot and best regards, Javi
Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef
Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature
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