Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef
Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]
Electronics Forum | Wed Sep 25 11:11:14 EDT 2002 | xrayhipp
Try .005 or even .004 thick laser cut electopolish stencil and reduce grain size of paste. Go with 400 or 25 in the case of AIM. We had a similar prob.
Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj
Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe
Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty
Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself
Electronics Forum | Thu Jun 29 09:12:27 EDT 2000 | sree
What is the best aperture opening for micrBGA with 0.8 mm ball pitch and 16 mils ball diameter?The pad size on the PCB is 12 mils.
Electronics Forum | Tue Jun 14 18:26:32 EDT 2005 | GS
You can find useful informations also on last review of IPC-7085 : Design and Assembly Process Implementation for BGA. Regards GS
Electronics Forum | Tue Jun 21 11:46:04 EDT 2005 | kenscj
Hi dave, Thanks for the comment. I have another issue. The board already pass Test and Burn-In processes, but after 2 months the BGA contact is found open (no contact on certain balls). How can that happen? Is it during build, the solder ball alrea
Electronics Forum | Thu Jan 30 06:44:20 EST 2003 | Grant Petty
Hi, Great, thanks for the info! Regards, Grant Petty Blackmagic Design www.blackmagic-design.com
