Electronics Forum: bga placement without paste (Page 1 of 32)

Re: bga

Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY

| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac

Re: bga

Electronics Forum | Tue Sep 07 06:14:27 EDT 1999 | Earl Moon

| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine

Re: bga

Electronics Forum | Tue Sep 07 22:07:56 EDT 1999 | NAZEEH CHAUDRY

| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac

large bga (55mmx44mm) capable placement machines?

Electronics Forum | Thu Sep 09 16:55:17 EDT 2004 | Sue

Yes, a MYDATA TP9 UFP machine can place components up to 2.2" square without any modifications. Refurbished TP9 UFP machines sell for about $45K in the USA.

BGA relow without solder paste?

Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS

IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa

BGA relow without solder paste?

Electronics Forum | Tue Sep 20 17:39:52 EDT 2005 | russ

If the balls are eutectic (63/37) You shouldn't have any problems. All of our BGA rework is performed without paste. You have plenty of solder to make the joint with the balls themselves. Be wary of cleaning however since the standoff is less.

BGA relow without solder paste?

Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris

HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne

BGA relow without solder paste?

Electronics Forum | Wed Sep 21 01:51:32 EDT 2005 | hly

Cognex board is bad. Waiting to get a replacement. Thanks for offering to help

BGA relow without solder paste?

Electronics Forum | Wed Sep 21 02:05:34 EDT 2005 | hly

Thank you for your reply.

BGA relow without solder paste?

Electronics Forum | Wed Sep 21 01:57:40 EDT 2005 | hly

Hi K, Thanks for your reply. I was wondering if there is an industry spec that specifies a minimum required solder volume for BGA joints? Thanks HLY

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