Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Tue Mar 09 22:06:24 EST 2004 | Ken
Two words that will send shivers down any self-respecting rework professionals spine: HEAT GUN Not affiliated with black and decker or vidal sasoon hair dryers.
Electronics Forum | Wed Jul 01 18:49:27 EDT 2009 | stevenlimth
1smtdude, I interested in your explaination of re-work an underfill part. You mention the material can be heated to a plastic state to become vicious... do you know usually what range is the temperate? (guess it can depend on the type/manufacturer o
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Wed Mar 17 19:57:08 EST 2004 | Dreamsniper
Do you wanna save the BGA or what? Do you have an electric stove, baking tray and a BBQ clip? Does your wife love cooking? if u have one of each, then u don't need a reflow oven which is too expensive and you don't need to buy heating guns or drill p
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare
I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Tue Dec 31 08:07:28 EST 2024 | amorapotter
Consider the thermal mass of the PoP assembly. The upper BGA might be shielding the lower BGA from adequate heat. You could test with an experimental setup that pre-solders the lower BGA separately to confirm whether heat transfer during reflow is th
