Electronics Forum | Fri Jan 22 16:03:17 EST 2021 | SMTA-64387124
Does anyone see any issues in mixing SMD and NSMD pads within one BGA footprint. We have high current pads which we want to make SMD and the other signal pads to be NSMD
Electronics Forum | Mon Sep 17 14:57:11 EDT 2001 | ert002
We are printing 0.012" apertures on a .012" Solder mask defined pad in a fine pitch BGA application. The board is 0.032" thick with very little room on the bottom to place support pins under these areas. Our first pilot proved extremely difficult to
Electronics Forum | Sun Aug 15 14:56:03 EDT 1999 | Dean
| One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with th
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Mon Aug 16 04:34:54 EDT 1999 | Earl Moon
| | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with
Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton
| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w
Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F
| | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact
Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB
| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta
Electronics Forum | Mon Jul 09 18:11:20 EDT 2012 | rsikora
Your selection of pads to use as Fids will be critical. In your pictures of the QFN component, the pcb pads are primarily non-solder mask defined, but on 3 sides of the QFN the corner pads become solder mask defined due to the copper ground flood.
Electronics Forum | Tue Sep 18 13:09:21 EDT 2001 | jschake
Hey, where's the 0201s? Just kidding. Off the top of my head, I do not recall seeing results of such a test. Nonetheless, I�ll consult with my peers and let you know if we come up with something that could assist you. That said, with a few more d
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