Electronics Forum: bga program (Page 1 of 16)

BGA Programming

Electronics Forum | Thu Jun 24 01:04:24 EDT 2004 | M.L. Feather

On the Universal GSM when programming BGA's, one of the first lines on the screen gives you letter choices A thru F what are these used for? I have always used A and now when I went to program a 16 array pattern, the letter A would not work so I went

Micro BGA baking

Electronics Forum | Fri Aug 10 02:30:46 EDT 2001 | praveen

Hello Friends, Please advise how critical is the Micro BGA baking? The BGA size is around 7x7mm and we need to program it before mounting. The Micro BGA's are supplied in Trays and are put in to tape and reel after programming.We need to put these BG

Programming equipments

Electronics Forum | Thu Apr 20 03:54:16 EDT 2000 | Anna & Sanda

Hello! We are interested in programming equipments (for devices like BGA, PLCC, TSOP, QFP etc.) and would like recieve names of suppliers. Thanks! // Anna & Sanda

BGA on IPII

Electronics Forum | Sat Oct 28 13:28:17 EDT 2000 | Ramon I Garcia C

Hi guys: I have IPII and MPM UP2000 not programable head, I need process BGA, but I never had been process it, I want to know "if I can run it, if not, what I need to do" Please give me some tips, and excuse my english. Ramon.

low cost SMT line

Electronics Forum | Mon Feb 21 00:35:42 EST 2011 | dman97

The Fuji CP6 and QP242 should be more than capable of placing 0402(cp6) and bga components (QP242). You must be having some programming difficulties.

BGA REMOVAL WITHOUT TEMPERATURE

Electronics Forum | Thu Mar 31 06:53:51 EDT 2022 | jineshjpr

Hi all, Can any one suggests that is there any method to remove BGA from a PCB without applying heat..??? Like any chemicals which can remove solder from both BGA & PCB without creating damages - Because customer feels heat application may erase the

Re: surrounding components

Electronics Forum | Tue Sep 19 14:40:13 EDT 2000 | Erick Russell

It is always a good idea to heat the entire board to 100C to 140C prior to reflowing the site to be reworked to reduce warp and localized stress. (Thermal uniformity of the preheater is key here). For a BGA, the laser is programmed to heat only the

My-Data TP9-UFP info please!!!

Electronics Forum | Mon Apr 30 09:55:50 EDT 2007 | rgduval

We're running an older TP9-U, and clocking in somewhere around 3000 cph, realistically. Placements, however, are very accurate. Works fine down to 0402's, high-pin count QFPs, etc. My -U doesn't do great on optical centering...it works, but it's a

Agilent 5DX

Electronics Forum | Mon Jul 30 05:43:24 EDT 2001 | andy

Hi - I'm looking at 5DX as a method for inspecting BGA joints and would like to hear from anyone with knowledge of this system . Can you tell me how reliable you have found it to be in catching BGA opens ? ...... also any other comments you may have

Need opinion about KE740 and KE760 !

Electronics Forum | Tue Jan 03 03:01:35 EST 2006 | Frank

The 740 and 760 basically have the same specs as far as component ranges: 0402-50mm components. The 760 is a bit more accurate and the vision system is better. The 740 was designed when BGA weren't really around and so it can barely vision center b

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