Electronics Forum | Fri Feb 09 16:29:22 EST 2007 | dave
Hi All, Thanks for all the replies. I am placing a 672 Pin BGA. Its the only BGA on the board (Board size 220mmx100mx1.6mm) We build these in batches of 400. So we have built approx 1200 since transition to Leadfree. Latest batch had 7 fails -
Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL
Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein
Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.
| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo
Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Fri Dec 18 00:49:43 EST 1998 | Mr Mariscal
I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it does
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
Electronics Forum | Thu Apr 10 19:21:02 EDT 2003 | tony_sauve
Kevin, One point that I'd like to make is that in order to get an accurate reading of the solder joint temp's you need to have the thermocouple right at the ball/PCB interface. I'd recommend precision drilling a mechanical sample of the unpopulated P
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Thu Mar 09 16:29:35 EST 2006 | russ
Will the Pb part handle 240C? That is the first question that you need to answer. If it will then yes I would run the pbfree paste and profile. I assume that all other components are pbfree. If not, the same questions will need be asked as for th
Electronics Forum | Fri Nov 08 17:49:04 EST 2002 | davef
Questions are: * So, what is your thinking on this "insufficient contact causing intermitten failures"? * How do you print the paste? * Where do you place your therocouples when measuring reflow temperature? * What kind of solderability protection is
