Electronics Forum | Tue May 23 09:55:47 EDT 2006 | TMC
Do you have an automated line with pick and place equipment that can handle your BGA's? Inspecting the board is a must after profile development. You may send the 1st board to a CEM for X-ray inspection. If you have a consistent process (printin
Electronics Forum | Tue Sep 14 02:46:17 EDT 2010 | grahamcooper22
Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on the pcb pad....but it looks like the BGA sphere was barely in contact with the pad. This could be caused by insufficient solder paste on this pad...may
Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony
| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi
Electronics Forum | Mon Oct 13 10:30:49 EDT 2003 | markhoch
PCB is 12.25" x 4". There are large MOSFETS on the board. Two large Electrolytic Caps. Two Large Multi-Layer Ceramic Caps. 15 C Size Tantalym Caps. A fair number of IC's, (SO-8's, SO-16's). No BGA's or finepitch of any kind. The board is double sided
Electronics Forum | Sun Nov 20 22:35:26 EST 2005 | pyramus
Hi guys!! Just want to ask regarding the Bluetooth Module. The module has BGA inside shield before production we checked Raw materials no short probems. But after Passing N2 Reflow during normal production the BGA inside module tend to get shorted..
Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2
Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa
Electronics Forum | Tue May 07 05:55:58 EDT 2002 | ianchan
Hi mate, do you mean : 1) Au = "ENIG" or "immersion Au(gold)"? or 2) Ag as in = "silver"? If Au is the correct term, no need to make extreme changes in your profile. just keep the profile to within your paste specs of preheat, reflow time and reflo
Electronics Forum | Thu Mar 28 11:06:49 EST 2002 | Tony Fox
Our company carries out this service for major OEM and CEM's Our web site address is http://www.retronix.co.uk Every device after it has been re-tinned gose throught a vision inspection system were it is inspected for coplinarity etc, we also re-ball
Electronics Forum | Thu Feb 11 06:50:17 EST 2010 | CL
Good Morning Bryan, We are using Mirtec MV-3 AOI's with 4 megapixle cameras. We use them for 100% post reflow. We are checking, presence, polarity, value, solder, bridging,component height for BGA, QFN etc... and 1st piece validation for machine set
Electronics Forum | Sun Jan 11 11:59:13 EST 1998 | Bob Willis
VP does work well for BGA Technology but it is not any great improvement on convection reflow. It has been stated in a coulpe of articles that there is no delta T difference with VP from the surface ofthe board and under the BGA. That is not true jus
