Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon
| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Thu Jun 28 16:55:45 EDT 2007 | hegemon
Hey Brian, Did you use the auto profile feature on your DRS25 machine to arrive at your profile? Our DRS25 has been doing quite well at larger BGA components. Most critical is a good preheat until the PCB reaches at least 140c, followed by a 2degC
Electronics Forum | Thu Jun 23 08:58:00 EDT 2005 | Irene Taylor
We are defining a new assembly process for a double sided card that has 26 BGAs on the top side and 14 BGAs on the bottom side. We currently have one double sided BGA board with one BGA per side and have to epoxy one BGA (35mm X 35mm - 352 ball count
Electronics Forum | Thu Feb 23 11:40:45 EST 2006 | billyd
My company is looking to run some small validation cards to verify our Pb free process for potential customers. Basocally, we'd like to print a small card, place some components, say 0402 to a small BGA, maybe some thru-hole stuff, and reflow it. So
Electronics Forum | Mon Aug 13 08:13:50 EDT 2007 | davef
Hi Bud We buy what you're selling, when you say, "I suspect ... coo planarity of the connector during soldering (bending like banana) and that is why first or last leg is not soldered." This component is probably acting like some BGA that curl at t
Electronics Forum | Thu Aug 17 08:44:14 EDT 2000 | Wolfgang Busko
Hi Jaqueline, my first thought goes into the same direction, twist or warp (either the board or the BGA itself). I don�t know the SRT equipment. I�ve noticed with our equipment using a spot underheat element caused some warpage of the PCB making it
Electronics Forum | Sat Mar 06 12:33:21 EST 1999 | Dean
| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Thu May 30 07:28:15 EDT 2002 | jaltland
Ben, Thanks for the input on the apertures and thickness. The side two problem, is not reflow. We have no trouble with reflow. The problem is that our product is high precision crystal oscillators. In order to get the precision needed, we have t
