Electronics Forum | Sat Dec 24 19:39:43 EST 2011 | dontfeedphils
I've reflowed many different size BGA's in an effort to better the connection and to help the board pass functional test. Using a middle of the road liquid flux and a convection spot rework machine and almost every time I would reflow a failed board
Electronics Forum | Mon Jun 04 16:27:55 EDT 2012 | jorge_quijano
Hello there, I just want to ask you how often do you take your profiles on the Reflow Oven and Wave solder? I have a HMLV line running 5-6 products per shift (Reflow Oven & WS) my tech spend too much time checking the profile, but no major difference
Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook
Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur
Electronics Forum | Sat Oct 17 10:43:29 EDT 1998 | smd
| Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... | | We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were
Electronics Forum | Mon Sep 30 04:27:40 EDT 2013 | grahamcooper22
I am not sure what the IPC spec is suggesting....K type thermocouples are normally specified upto 1250 C, of course there is a tolerance in their accuracy and this probably degrades after hundreds of uses through a reflow oven, but normally the accur
Electronics Forum | Thu Sep 10 13:09:28 EDT 1998 | Rick Thompson
Hi, I'm having trouble getting good profiles for a couple of BGA's we're placing in small quantities and was hoping someone with SRT Summit 1000 experience might be willing to share some information regarding profiles, etc. Thanks. Rick Thompson
Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Tue Dec 28 22:29:14 EST 2004 | davef
Doesn't make sense. Either your: * Oven is not operting properly [attach your profiler thermocouple to the baffle of each zone with a screw to check] ... OR * Conveyor speed is too high ... OR * Profiler is defective
Electronics Forum | Mon Jul 18 01:47:29 EDT 2005 | Cal
I would suggest 1) Use the profile that is suggested with the BGA types you are using or 2) Have you solder paste rep visit for a half day and help profile your machine. Remember if they want to keep you as a paste customer they will help. Enjoy,
