Electronics Forum | Thu Jul 07 18:10:20 EDT 2005 | russ
You should use Xray to qualify your process. Frequency of Xray inspection after that will need to be determined by your process capability. If you use paste inspection process, once you verify that your profile and placement are good you in theory
Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman
| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Mon Apr 19 11:04:21 EDT 2010 | baildl632
We have had some unusual reflow conditions with BGA's as well. We did not come to the conclusion that something was covering the lands though. It typically occured with only the BGA lands (not the decoupling caps on the back side). We found that the
Electronics Forum | Fri Jul 21 13:37:35 EDT 2006 | Chunks
Stencil clog on BGA apps. BGA not reflowing all the way - check profile.
Electronics Forum | Tue May 01 06:54:22 EDT 2007 | LC
Hi, We are encountering BGA problems where it dislodge from the board. Some are just by normal handling and some are results from drop test about 15 cm high. We have checked our profile and they are in accordance to the BGA recommended reflow profil
Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
Electronics Forum | Fri Apr 13 09:41:41 EDT 2007 | aj
All, I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works. Clearly there is an issue with the wetting of some Balls causing a poor connection. My profile looks spot on - I think I poste
Electronics Forum | Tue Oct 03 09:23:55 EDT 2006 | kenscj
We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diagnosed this BGA open connection (2 locations), by using multimeter. Under 5DX inspection, there is connection. Take the board for localised reflow at
