Electronics Forum | Tue Sep 09 15:07:04 EDT 2008 | ksrsr
We bake before we replace our BGA's for at least 12 hours at 125C.
Electronics Forum | Tue May 19 06:57:33 EDT 2009 | cunningham
whats the reason for the underfill? we dont underfill any of our BGAs rework could be a issue if they need to be replaced? tried DP190?
Electronics Forum | Wed Sep 03 16:52:22 EDT 2008 | phongng_99
Hi, Do we need to bake the board before doing the BGA replacement (not reball process). Thanks Phong Nguyen
Electronics Forum | Thu Sep 04 06:58:46 EDT 2008 | davef
If you plan to reuse the BGA, you probably should bake the moisture from the component prior to removing it from the board.
Electronics Forum | Tue Sep 09 16:00:07 EDT 2008 | ppcbs
We always bake our loaded boards before any BGA rework is done. 12 to 16 hours at 100 c. We have had incidents in the past on loaded boards where 125 c has melted parts and the occasional low temp BGA trays. 100 c has proven safe for the past 10 y
Electronics Forum | Tue Sep 09 16:04:25 EDT 2008 | allan99
I don't think so if your process is a just in time rework, you have just to develop a profile at your rework station for each component and also clean the place (board) properly. If your process is not a JIT rework, you must have to bake the boards,
Electronics Forum | Sat Jul 26 11:40:09 EDT 2003 | mantis
All, Is it possible and reliable to replace bga's on Enig boards with out suffering from mass fallout due to blackpad defect.I have a couple of boards requiring bga replacment but i have been told that it is not possible to replace them reliable that
Electronics Forum | Mon Jul 28 16:32:45 EDT 2003 | itempea
Mant, we are reliably replacing BGAs of all sizes and pitches on ENIG. The black pad is not something created through rework, but a defect that the PCB has from the very beginning. Ioan
Electronics Forum | Mon Aug 19 15:42:27 EDT 2002 | loquetis
Is there any significant difference in the time required (average) to reflow a BGA component versus replacing the component? My company is attempting to determine the time to break-even for capital investment in a BGA workstation.
Electronics Forum | Tue Jul 29 09:28:24 EDT 2003 | russ
Why would you get black pad from rework? I could be wrong but once the pad has accepted solder from the first reflow process wouldn't that eliminate the possibility of a latent finish defect? I am curious. We do perform rework on ENIG all of the tim
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