Electronics Forum | Thu Jan 18 08:26:49 EST 2007 | Jeff
So you are suggesting to begin heating using a preheater only . . . then when the thermocouple under my PBGA reads around 130C, turn on a top side heater? Thanks
Electronics Forum | Thu Jan 18 08:31:09 EST 2007 | Jeff
Thanks. I will turn off the machine activated cooling and have the part cool down at room temp (no compressed air cooling). Can you recommend a good paste / tacky flux?
Electronics Forum | Fri Jan 19 11:42:40 EST 2007 | russ
yeah Jeff, i would make sure that you are not overheating part trying to get the balls to temp. Indium will sell you a couple of these cartridges for sure. Good Luck Russ
Electronics Forum | Wed Jan 17 17:09:43 EST 2007 | russ
appears to be incomplete reflow on a couple of balls or they were moved during a cooldown. it also seems as though there is a deviation in ball size due to inconsistant paste application possibly. I would stop applying paste and just reflow that pa
Electronics Forum | Thu Jan 18 13:13:53 EST 2007 | russ
won;t recommend a paste since I propose that you do not use but here is a flux I have had great success with Indium tacflux 20B IPN 84283 No clean flux, Use this alone without paste and your BGAs will work!! What was your package temp during th
Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39
When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.
Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Wed Apr 28 23:05:56 EDT 2004 | FocalSpot
Hi Daniel, I would suggest you check out http://www.focalspot.com. FocalSpot offers an advanced rework station from Japan, the RD-500 Series, which is unique to the industry and tailored for lead free rework and challenging BGA applications due i
Electronics Forum | Fri Dec 13 16:39:42 EST 2002 | Gris
Hi, Look for papers on SMTA there are a lot of papers on lead free rework. If you dont find any let us know here I am sure you will receive many. Here are a just a few http://www.google.com/search?hl=en&ie=UTF-8&oe=UTF-8&q=%22lead+free+rework%22&
