Electronics Forum: bga rework lifting (Page 1 of 141)

BGA pads lifting from PCB

Electronics Forum | Thu Jul 02 13:10:22 EDT 2009 | kpm135

On first glance it looks like those particular pads were not attached to any traces. If I had to guess I would say that your rework profile got hot enough to melt away the glue holding the pads to the board and they came away with your part when you

bga

Electronics Forum | Mon Sep 06 15:43:25 EDT 1999 | jerrdog

I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". these machines dont even offer bga selections. These machines dont e

bga rework m/c

Electronics Forum | Tue Nov 14 11:38:44 EST 2000 | Jacqueline Coia

Hi there, Making a request here, Does anyone out there in Scotland know of any company that has a 'SRT' BGA rework machine??? ta Jack

Re: bga rework m/c

Electronics Forum | Thu Nov 16 05:28:59 EST 2000 | Jacqueline

Heres my mail address; jacqueline_coia@solectron.co.uk

Re: bga rework m/c

Electronics Forum | Tue Nov 14 13:34:28 EST 2000 | Leon

Jack Yes I have one. But I am not in Scotland. can I help you? Leon

Re: bga rework m/c

Electronics Forum | Thu Nov 16 05:05:59 EST 2000 | andy

Jack , I am in Scotland and can help you with this . Please leave a mail address where we can talk offline . Andy .

underfilling of bga

Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo

Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar

BGA pads lifting from PCB

Electronics Forum | Thu Jul 02 16:01:57 EDT 2009 | ewchong

thanks kpm. agree the cause of those pads lifting. all of them were no connects so they cannot be the cause of the electrical failure. when the bga was removed, all the solder balls on the pcb turned into conical shape due to the separation, except

BGA pads lifting from PCB

Electronics Forum | Tue Jul 07 05:55:34 EDT 2009 | kpm135

I agree with your assessment of the two pins with irregular solder. The head-in-pillow or broken joint are both probable events for your defect. At this point in the process it will probably be difficult to pinpoint the exact cause. If it was a broke

BGA pads lifting from PCB

Electronics Forum | Wed Jul 01 12:26:52 EDT 2009 | ewchong

can anyone suggest possible causes or further analysis for the lifted pads in attached picture. thanks.

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